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    Dell EMC PowerEdge R650 1U Server

    Dell EMC PowerEdge R650 1U Server

    The Dell EMC PowerEdge R650, is a full-featured enterprise server, designed to optimize workloads performance and data center density.

    Descriptions

     

    The Dell EMC™ PowerEdge™ R650 is Dell EMC's latest 1U 2-socket designed to run complex workloads using highly scalable memory, I/O, and network options. The system features the 3rd Generation Intel® Xeon® Processor Scalable family, with up to 32 DDR4 DIMMs, up to 3 PCI Express® Gen4 enabled expansion slots, and a choice of embedded NIC technologies .

    The PowerEdge R650 is a dense, general purpose platform that is ready to run any workload found within a customer's datacenter . The following table lists some of these workloads and the situations wherein the PowerEdge R650 is a good fit.

     

    Chassis views

     

    Front view of the R650, 4x 3.5 inches Chassis

    Front view of the R650, 4x 3.5 inches Chassis

     

    Front view of the R650, 8x 2.5 inches SAS/SATA Chassis

    Front view of the R650, 8x 2.5 inches SAS/SATA Chassis

     

    Front view of the R650, 8x 2.5 inches NVMe Chassis

    Front view of the R650, 8x 2.5 inches NVMe Chassis

     

    Front View of the R650, 10x 2.5 inches SAS/SATA or NVMe

    Front View of the R650, 10x 2.5 inches SAS/SATA or NVMe

     

    Rear view of the R650 with 3x LP PCIe Gen4 slots and Hot-plug BOSS

    Rear view of the R650 with 3x LP PCIe Gen4 slots and Hot-plug BOSS

     

    Rear view of the R650 with 2x 2.5 inches Storage drives, 1x LP PCIe Gen4 slot and Hot-plug BOSS

    Rear view of the R650 with 2x 2.5 inches Storage drives, 1x LP PCIe Gen4 slot and Hot-plug BOSS

     

    Rear view of the R650 with 2x FH PCIe Gen4 slots and Hot-plug BOSS without rear storage

    Rear view of the R650 with 2x FH PCIe Gen4 slots and Hot-plug BOSS without rear storage

    R650 New technologies

     

    Technology

    Detailed Description

    3rd Generation Intel® Xeon®  Processor Scalable Family

    Consult the supported processors section for specific SKU details .

    ●   10 nm process technology

    ●   3x Intel®  Ultra Path Interconnect (UPI) per CPU at 10.4 GT/s or 11.2 GT/s

    ●   64 PCIe Gen4 lanes at 16 GT/s

    ●   Up to 40 cores per socket

    ●   Up to 3.6 GHz

    ●   Max TDP: 270W

    3200 MT/s DDR4 memory

    ●   Max 16 DIMMs per CPU

    ●   Supports DDR4 RDIMM, LRDIMM, 3DS DIMM and with ECC up to 3200MT/s

    Persistent memory

    ●   Supports DDR4 Intel Persistent Memory 200 series up to

    3200 MT/s, max 8x 512GB Intel Persistent Memory 200 series DIMMs per CPU .

    Flex IO

    ●   LOM board, 2x1 Gb with BCM5720 LAN controller

    ●   Standard rear IO with 1 Gb dedicated management     network port, USB 3.0 x 1, USB 2.0 x 1, and VGA port

    ●   Serial port option with standard RIO board

    ●   OCP Mezz 3.0 (supported by x8 PCIe lanes)

    ●   LC rear IO with 1 Gb dedicated management network port, USB 3.0 x 1, USB 2.0 x 1

    ●   Serial port or VGA port option with LC RIO board

    Dedicated PERC

    ●   Front storage module PERC with front PERC10 .5 & PERC11

    Software RAID

    ●   OS RAID/S150

    Power supplies

    ●   60 mm dimension is the new PSU form factor on 15G design

    ●   Platinum 800W AC Mixed Mode

    ●   Titanium 1100W AC Mixed Mode

    ●   Platinum 1400W AC Mixed Mode

    ●   1100W - 48V DC

    System Features and Generational Comparison

     

    The following table shows the comparison between the PowerEdge R650 with the PowerEdge R640:

    Feature

    PowerEdge R650

    PowerEdge R640

    CPU

    2 x 3rd Generation Intel® Xeon®

    Processor Scalable Family

    2 x 2nd Generation Intel® Xeon®

    Processor Scalable Family

    CPU interconnect

    Intel Ultra Path Interconnect (UPI)

    Intel Ultra Path Interconnect (UPI)

    Memory

    32 x DDR4 RDIMM, LRDIMM

    16 x PMem ( Intel Optane Persistent Memory 200 Series)

    24 x DDR4 RDIMM, LRDIMM

    12 x NVDIMM

    12 x PMem (Intel Optane Apache Pass)

    Storage drives

    3.5 inches, 2.5 inches- 12 Gb SAS, 6 Gb SATA, NVMe

    3.5 inches, 2.5 inches- 12 Gb SAS, 6 Gb SATA, NVMe

    Storage controllers

    Adapters: HBA355E, H840

    PERC: HBA355i, H345, H355, H745, H755, H755N

    BOSS- S1 adapter                              

    BOSS S2

    SW RAID: S150

    Adapters: HBA330, H330, H730P, H740P, H840, 12G SAS HBA Mini Mono: HBA330, H330, H730P, H740P SW

    RAID: S140

    PCIe SSD

    Up to 10+2 (10 x direct attach in front, and 2 x direct attach in rear)

    Up to 10 (8 x direct attach, 2 x from PCIe bridge card)

    PCIe slots

    Max 3 PCIe 4.0

    Max 3 PCIe 3.0

    LOM

    2 x 1 Gb

    NA

    Networking

    OCP 3.0 (x8 PCIe)

    rNDC

    Rack height

    1U

    1U

    Power supplies

    100~240 V AC/240 V DC: 800 W, 1100 W, 1400 W

    DC - 48 V ~- 60 V :1100 W

    AC (Platinum): 495 W, 750 W, 1100 W, 1600W, 2000W, 2400W

    AC (Titanium): 750 W

    DC: 1100 W

    Mix Mode/HVDC: 750 W, 1100 W

    System management

    LC 4 .x, OpenManage, QuickSync2 .0, Digital License Key, iDRAC Direct     (dedicated micro- USB port), Easy Restore

    LC 3 .x, OpenManage, QuickSync 2 .0, OMPC3, Digital License Key, iDRAC Direct (dedicated micro- USB port), Easy Restore, vFlash

    Internal GPU

    Up to 3 x 75 W (SW)

    Up to 3 x 70 W (SW)

    Availability

     

    Hot-plug drives

    Hot-plug redundant cooling

    Hot-plug redundant power supplies

    Hot-plug BOSS S2

    IDSDM

    Hot-plug drives

    Hot-plug redundant cooling

    Hot-plug redundant Power supplies

    BOSS

    IDSDM

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