PowerEdge R760 and R750 Comparison and Features

Features

PowerEdge R760

PowerEdge R750

Processors

2 x 4th Gen Intel® Xeon® Scalable Processors

2 x 3rd Generation Intel® Xeon® Processor Scalable Family

CPU interconnect

Intel Ultra Path Interconnect (UPI)

Intel Ultra Path Interconnect (UPI)

Memory

●   32 x DDR5 RDIMM

●   Up to 4800 MT/s (1 DPC) / 4400 MT/s (2 DPC)

●   32 x DDR4 RDIMM, LRDIMM

●   16 x PMem ( Intel Optane Persistent Memory 200 Series)

Storage Controllers

●   PERC 11G: H755, H755N, H355

●   PERC 12G: H965i

●   HBA 11: HBA355i, HBA355e

●   BOSS- N1

●   Software RAID: S160

●   PERC 10G: H345, H745, H840

●   PERC 11G: H755, H755N, H355

●   HBA 11: HBA355i, HBA355e

●   BOSS-S1 adapter

●   BOSS-S2

●   Software RAID: S150

Drive Bays

Front bays:

●   3.5 inches, 2.5 inches - 24Gb SAS, 6Gb SATA

●   2.5 inches - Gen3/4 NVMe Rear bay:

●   2.5 inches - 24Gb SAS, 6Gb SATA, Gen3/4 NVMe

Front bays:

●   3.5 inches, 2.5 inches - 12Gb SAS, 6Gb SATA

●   2.5 inches - Gen3/4 NVMe Rear bay:

●   2.5 inches - 12Gb SAS, 6Gb SATA, Gen3/4 NVMe

Power Supplies

●   AC (Platinum): 800 W, 1400 W, 2400 W

●   AC (Titanium): 700 W, 1100 W, 1800 W,

2800 W

●   LVDC @-48VDC Input: 1100 W

●   AC (Platinum): 800 W, 1400 W, 2400 W

●   AC (Titanium): 700 W, 1100 W

●   LVDC @-48VDC Input: 1100 W

Cooling Options

●   Air Cooling

●   Optional Direct Liquid Cooling (DLC)

●   Air Cooling

●   Optional Direct Liquid Cooling (DLC)

NOTE: DLC is a rack solution and requires rack manifolds and a cooling distribution    unit (CDU) to operate .

NOTE: DLC is a rack solution and requires rack    manifolds and a cooling distribution unit (CDU) to operate .

Fans

Standard (STD) fans /High performance Silver (HPR) fans/ High performance Gold (VHP)     fans

Standard (STD) fans /High performance Silver  (HPR) fans/ High performance Gold (VHP) fans

Up to six hot swap fans

Up to six hot swap fans

Dimension

Height: 86.8 mm (3 .41 inches)

Height: 86.8 mm (3 .41 inches)

Width: 482 mm (18 .97 inches)

Width: 482 mm (18 .97 inches)

Depth: 772.13 mm (30 .39 inches) with bezel

Depth: 772.13 mm (30 .39 inches) with bezel

758.29 mm (29 .85 inches) without bezel

758.29 mm (29 .85 inches) without bezel

Features

PowerEdge R760

PowerEdge R750

Form Factor

2U rack server

2U rack server

Embedded

Management

●   iDRAC9

●   iDRAC Direct

●   iDRAC RESTful with Redfish

●   iDRAC Service Manual

●   Quick Sync 2 wireless module

●   iDRAC9

●   iDRAC Direct

●   iDRAC Service Module

●   Quick Sync 2 wireless module

Bezel

Optional LCD bezel or security bezel

Optional LCD bezel or security bezel

OpenManage

Software

●   CloudIQ for PowerEdge plug in

●   OpenManage Enterprise

●   OpenManage Enterprise Integration for VMware vCenter

●   OpenManage Integration for Microsoft System Center

●   OpenManage Integration with Windows Admin Center

●   OpenManage Power Manager plugin

●   OpenManage Service plugin

●   OpenManage Update Manager plugin

●   OpenManage Enterprise

●   OpenManage Power Manager plugin

●   OpenManage SupportAssist plugin

●   OpenManage Update Manager plugin

Mobility

OpenManage Mobile

OpenManage Mobile

Integrations and

Connections

OpenManage Integrations

●   BMC TrueSight

●   Microsoft System Center

●   OpenManage Integration with ServiceNow

●   Red Hat Ansible Modules

●   Terraform Providers

●   VMware vCenter and vRealize Operations Manager

OpenManage

Integrations

●   BMC TrueSight

●   Microsoft System Center

●   Red Hat Ansible Modules

●   VMware vCenter

●   IBM Tivoli Netcool/ OMNIbus

●   IBM Tivoli Network Manager IP Edition

●   Micro Focus Operations Manager

●   Nagios Core

●   Nagios XI

Security

●   Cryptographically signed firmware

●   Secure Boot

●   Secure Erase

●   Silicon Root of Trust

●   System Lockdown (requires iDRAC9 Enterprise or Datacenter)

●   TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ

●   Secured Component Verification (Hardware integrity check)

●   Data at Rest Encryption (SEDs with local or external key mgmt)

●   Cryptographically signed firmware

●   Secure Boot

●   Secure Erase

●   Silicon Root of Trust

●   System Lockdown (requires iDRAC9 Enterprise or Datacenter)

●   TPM 1 .2/2 .0 FIPS, CC-TCG certified, TPM 2.0 China NationZ

Embedded NIC

2 x 1 GbE LOM (optional)

2 x 1 GbE LOM

Networking Options

OCP x8 (optional) Mezz 3.0

 NOTE: The system allows either LOM card

or an OCP card or both to be installed in the system .

OCP x8 Mezz 3.0

GPU Options

Up to two double wide 350 W, or six single wide 75 W accelerators

Up to two double wide 300 W, or eight single wide 75 W accelerators

Ports

Front Ports

●   1 x USB 2.0

●   1 x USB 3.0

●   1 x iDRAC Direct (Micro-AB USB) port

Rear Ports

●   1 x USB 2.0

●   1 x Dedicated    iDRAC Ethernet port

●   1 x USB 3.0

●   1 x Serial port (optional)

●   1 x VGA(optional for Direct Lliquid Cooling configuration)

Front Ports

●   1 x USB 2.0

●   1 x USB 3.0

●   1 x iDRAC Direct (Micro-AB USB) port

Rear Ports

●   1 x USB 2.0

●   1 x Dedicated iDRAC Ethernet port

●   1 xUSB3.0

●   1 xSerial port (optional)

●   1 xVGA (optional for Direct Liquid Cooling configuration)